A modular pulsed UV light curing system for semiconductor wafer fabrication procedures including UV curing, surface treatment, and dicing tape removal is being introduced by Xenon Corp. of Woburn, Massachusetts.

The Xenon RC-742 Pulsed UV Curing System cures delicate semiconductor wafer surfaces using high peak power with low heat which eliminates the heat buildup, energy consumption, and safety issues associated with continuous wave mercury lamps. Ideal for wafer surface preparation and treatment, pulsed UV light penetrates heat sensitive substrates and cures the coating on dicing tape to assure removal without leaving any residue.

Capable of producing 1,190 w/cm² peak power to provide greater penetration and deeper curing in under <0.5 sec., with minimal heat, the Xenon RC-742 Pulsed UV Curing System features instant ON/OFF, fast cycle times and cool operation. Modular design allows for simple integration of these mercury-free lamps into virtually any semiconductor wafer fabrication system.

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